Experience

LG Electronics

R&D Engineering Intern | Atlanta, GA | May 2024 - Aug 2024

I worked on R&D hardware and manufacturing robustness for sensor assemblies and PCBAs, balancing reliability, manufacturability, and defect reduction at production scale.

Impact Highlights

24% reduction in assembly errors

18% reduction in defect rates

FEA-driven reinforcement optimization

What I Did

At LG Electronics, I worked on R&D hardware and manufacturing robustness for sensor assemblies and PCBAs, focusing on reliability, manufacturability, and defect reduction. I developed comprehensive GD&T specifications for R32 sensor housing assemblies using dimensioning strategies that preserved critical tolerances while improving manufacturability, which helped reduce assembly errors by 24%.

I performed FEA stress analysis on PCB mounting structures for R32 leakage sensors and used results to optimize reinforcement geometry and mounting options to withstand vibrational loads during operation. Alongside mechanical validation, I applied Lean Six Sigma and DFM principles to Smart Thermostat PCBAs, using root-cause analysis to identify sources of recurring manufacturing defects and implementing targeted design revisions that reduced defect rates by 18%. The work combined mechanical design discipline, analysis-driven iteration, and manufacturing feedback to deliver more reliable assemblies at scale.

Skills & Tools

GD&T FEA Stress Analysis DFM Lean Six Sigma RCA PCB Mechanical Design Vibration Loads Manufacturing Feedback Loops

Process

Step 1

Discover

I used manufacturing feedback and root-cause analysis to map recurring assembly and PCBA defect patterns.

Step 2

Design

I developed GD&T strategies and adjusted housing and mounting geometry to improve manufacturability.

Step 3

Validate

I ran FEA stress studies and validated reinforcement behavior under vibration-driven operating loads.

Step 4

Deploy

I implemented targeted design revisions that reduced error-prone assembly conditions and defect recurrence.

Artifacts

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GD&T Release

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FEA Snapshot

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Defect RCA Summary

Key Takeaways

I developed stronger precision in defining tolerances that are both robust and manufacturable.
I sharpened how I convert FEA insight into practical reinforcement and mounting decisions.
I improved at linking Lean Six Sigma and DFM methods directly to measurable defect reduction.